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FS1150R08A8P3LMC
  • FS1150R08A8P3LMC

FS1150R08A8P3LMC

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Infineon Technologies FS1150R08A8P3LMC Product Info

16 April 2026 0

Parameters

Configuration

Sixpack

Features

Long Tabs, PinFin Base Plate

Housing

HybridPACK™ Drive G2

IC(nom) / IF(nom)

1150 A

Launch year

2024

Planned to be available until at least

2038

Qualification

Automotive

Technology

IGBT EDT3

VCE(sat) (Tvj=25°C typ)

1.08 V

VCES (Tvj=25°C typ)

750 V

Voltage Class max

750 V

Features

  • VCES = 750 V
  • ICN = 1150 A / ICRM = 2300 A
  • Blocking voltage 750 V
  • Low VCE,sat
  • Low switching losses
  • Low Qg and Crss
  • Low inductive design
  • 4.2 kV DC 1 second insulation
  • High creepage and clearance distances
  • Direct-cooled PinFin base plate
  • PCB and cooler assembly guidelines
  • PressFIT contact technology

Description

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design
  • Lower system BOM
  • Lower AC contact resistance
  • Lower tab temperature
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

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