Product
0
FS1150R08A8P3C
  • FS1150R08A8P3C

FS1150R08A8P3C

Active and preferred

This HybridPACK™ Drive G2 module is a very compact six-pack power module with enhanced package optimized for hybrid and electric vehicles

Infineon Technologies FS1150R08A8P3C Product Info

16 April 2026 0

Parameters

Configuration

Sixpack

Features

PinFin Base Plate, short tabs without hole

Housing

HybridPACK™ Drive G2

Launch year

2025

Planned to be available until at least

2038

Qualification

Automotive

RthJC max

0.118 K/W

Technology

IGBT EDT3

VCES (Tvj=25°C typ)

750 V

Voltage Class max

750 V

Features

  • VCES = 750 V
  • ICN = 1150 A / ICRM = 2300 A
  • Blocking voltage 750 V
  • Low VCE,sat
  • Low switching losses
  • Low Qg and Crss
  • Low inductive design
  • 4.2 kV DC 1 second insulation
  • High creepage and clearance distances
  • Direct-cooled PinFin base plate
  • PCB and cooler assembly guidelines
  • PressFIT contact technology

Description

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design
  • Lower system BOM
  • Lower AC contact resistance
  • Lower tab temperature
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8