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FF3MR20W3M1H_H11
  • FF3MR20W3M1H_H11

FF3MR20W3M1H_H11

Active and preferred

EasyPACK™ 3B CoolSiC™ MOSFET 2000 V half-bridge module, integrated NTC temperature sensor and High Current Pin.

Infineon Technologies FF3MR20W3M1H_H11 Product Info

16 April 2026 0

Parameters

Applications

ESS, EV Charging, UPS

Configuration

Half-bridge

Dimensions (width)

62 mm

Dimensions (length)

110 mm

Features

PressFIT

Housing

Easy 3B

Qualification

Industrial

Apps

Battery energy storage (BESS)

Features

  • Easy family with 12mm height
  • Gate-source voltages of +23 V and -10 V
  • Very low stray inductance
  • Overload capabilities up to 175°C
  • High current pin

Description

  • Easy to design
  • Highest power density by lowest RDS
  • Outstanding module efficiency
  • A low FIT rate for cosmic ray induced fails

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