Product
0
FF300R17ME4P_B11
  • FF300R17ME4P_B11

FF300R17ME4P_B11

Active and preferred

EconoDUAL™ 3 1700 V. 300 A half-bridge IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled Diode, NTC, PressFIT Contact Technology and pre-applied Thermal Interface Material .

Infineon Technologies FF300R17ME4P_B11 Product Info

16 April 2026 0

Parameters

Configuration

half-bridge

Dimensions (width)

62 mm

Dimensions (length)

152 mm

Features

TIM, PressFIT

Housing

EconoDUAL™ 3

IC(nom) / IF(nom)

300 A

IC max

300 A

Qualification

Industrial

Technology

IGBT4 - E4

VCE(sat) (Tvj=25°C typ)

1.95 V

VCES / VRRM

1700 V

VF (Tvj=25°C typ)

1.8 V

Voltage Class max

1700 V

Apps

Wind power, Motor control, Uninterruptible power supplies (UPS)

Features

  • Low VCEsat
  • Tvj op = 150°C
  • VCEsatwith positive temp. coeffi.
  • High power density
  • Isolated base plate
  • Standard housing
  • Pre-applied thermal interface mat.

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8