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FF300R17KE4P
  • FF300R17KE4P

FF300R17KE4P

Active and preferred

62 mm 1700 V, 300 A half-bridge IGBT module with pre-applied Thermal Interface Material are are the right choice for your design.

Infineon Technologies FF300R17KE4P Product Info

16 April 2026 0

Parameters

Configuration

half-bridge

Dimensions (width)

61.4 mm

Dimensions (length)

106.4 mm

Features

TIM

Housing

62 mm

IC(nom) / IF(nom)

300 A

IC max

300 A

Qualification

Industrial

Technology

IGBT4 - E4

VCE(sat) (Tvj=25°C typ)

1.95 V

VCES / VRRM

1700 V

VF (Tvj=25°C typ)

1.8 V

Voltage Class max

1700 V

Apps

Wind power, Motor control, Uninterruptible power supplies (UPS)

Features

  • Extended op. temperature T vj op
  • Low VCEsat
  • Unbeatabel robustness
  • VCEsat with pos. temp. coefficient
  • Isolated base plate
  • Standard housing
  • 4 kV AC 1 min insulation
  • Package with CTI > 400
  • High creepage & clearance distances
  • Pre-applied thermal interface mat.

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