Product
0
FF300R12KE4P
  • FF300R12KE4P

FF300R12KE4P

Active and preferred

62 mm 1200 V, 300 A half-bridge IGBT module with TRENCHSTOP™ IGBT4, optimized emitter controlled diode and pre-applied Thermal Interface Material

Infineon Technologies FF300R12KE4P Product Info

16 April 2026 0

Parameters

Configuration

half-bridge

Dimensions (length)

106.4 mm

Dimensions (width)

61.4 mm

Features

TIM

Housing

62 mm

IC(nom) / IF(nom)

300 A

IC max

300 A

Qualification

Industrial

Technology

IGBT4 - E4

VCE(sat) (Tvj=25°C typ)

1.75 V

VF (Tvj=25°C typ)

1.65 V

Voltage Class max

1200 V

Apps

Wind power, Motor control, Uninterruptible power supplies (UPS)

Features

  • Operating temperature up to 150 °C
  • UL/CSA Certif. with UL1557 E83336
  • Optimized switching softness
  • Reduced switching losses
  • High current capability
  • RoHS compliant

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8