Product
0
F4-8MR12W2M1H_B70
  • F4-8MR12W2M1H_B70

F4-8MR12W2M1H_B70

Active and preferred

EasyPACK™ 2B CoolSiC™ MOSFET fourpack module 1200 V, 8 mΩ G1 with NTC, PressFIT contact technology and aluminium nitride ceramic.

Infineon Technologies F4-8MR12W2M1H_B70 Product Info

16 April 2026 0

Parameters

Applications

UPS, SST, EV Charger, Solar, ESS

Configuration

Fourpack

Dimensions (width)

48 mm

Dimensions (length)

62.8 mm

Features

PressFIT

Housing

Easy 2B

Qualification

Industrial

RDS (on) (@ Tj = 25°C)

8.1 mΩ

Apps

Battery energy storage (BESS), EV charging, Photovoltaic, Uninterruptible power supplies (UPS)

Features

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor

Description

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8