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CYW20706
  • CYW20706

CYW20706

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The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

Infineon Technologies CYW20706 Product Info

16 April 2026 0

Parameters

Bluetooth Classic

Yes

Bluetooth EDR 2MBPS RX SENSITIVITY

-95.5 dBm

Bluetooth LE RX SENSITIVITY

-96.5 dBm

Bluetooth LE TX POWER

9 dBm

Bluetooth LE

Yes

Bluetooth Specification

5.4

CPU Frequency

48 MHz

CPU

Arm® Cortex®- M3

Family

AIROC™ Bluetooth LE & Bluetooth

GPIOs

24

Launch Date

2025

Longevity - 15 years

Yes

Longevity - Extended

No

Operating Temperature range

-30 °C to 85 °C

Operating Voltage range

1.62 V to 3.6 V, 2.25 V to 2.94 V

Partner Module

Y

Planned to be available until at least

31-12-2030

RAM

352 kByte

ROM

848 kByte

Software Support

ModusToolbox™

Apps

Semiconductor solutions for home entertainment applications, Health and lifestyle

Features

  • Arm® Cortex®-M3 32-bit RISC processor
  • Embedded ICE-RT debug
  • SWD interface units
  • 352-KB on-chip RAM
  • Bluetooth® core specification 5.2
  • Integrated low dropout regulators (LDO)
  • LE data rate up to 2 Mbps
  • Up to 24 GPIOs
  • I²C, I²S, UART, and PCM interfaces

Description

  • Support for BR, EDR, and Bluetooth® LE
  • Support for EEPROM and serial flash

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