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ADN4693E-1
  • ADN4693E-1
  • ADN4693E-1

ADN4693E-1

RECOMMENDED FOR NEW DESIGNS

3.3 V, 200 Mbps, Full-Duplex, High Speed M-LVDS Transceiver

Analog Devices ADN4693E-1 Product Info

10 February 2026 5

Features

  • Full Duplex M-LVDS transceiver (driver and receiver pair)
  • Switching rate: 200 Mbps (100 MHz)
  • Type 1 receiver with hysteresis of 25 mV
  • Compatible with the TIA/EIA-899 standard for M-LVDS
  • Glitch free power-up/power-down on M-LVDS bus
  • Controlled transition times on driver output
  • Common-mode range: −1 V to +3.4 V, allowing communication with 2 V of ground noise
  • Driver outputs high-Z when disabled or powered off
  • Enhanced ESD protection on bus pins
    • ≥±15 kV HBM, air discharge
    • ≥±8 kV HBM, contact discharge
    • ≥±10 kV IEC 61000-4-2, air discharge
    • ≥±8 kV IEC 61000-4-2, contact discharge
  • Operating junction temperature range: −40°C to +120°C
  • 16-lead, 4 mm x 4 mm LFCSP package

Part details & applications

The ADN4693E-1 is a multipoint, low voltage differential signaling (M-LVDS) transceiver (driver and receiver pair) that can operate at up to 200 Mbps (100 MHz) nonreturn to zero (NRZ). The receiver detects the bus state with a differential input of as little as ±50 mV over the common-mode voltage range of the device. Electrostatic discharge (ESD) protection of up to ±15 kV is implemented on the bus pins. The ADN4693E-1 is designed to the TIA/EIA-899 standard for M-LVDS and complement TIA/EIA-644 LVDS devices with additional multipoint capabilities.

The ADN4693E-1 features a Type 1 receiver with 25 mV of hysteresis so that slow-changing signals or loss of input does not lead to output oscillations.

This full-duplex device is available in a compact 16-lead, 4 mm × 4 mm lead frame chip scale package (LFCSP). The ADN4693E-1 is specified over the -40⁰C to +120⁰C junction temperature range.

APPLICATIONS

  • Backplane and cable multipoint data transmission
  • Multipoint clock distribution
  • Low power, high speed alternative to shorter RS-485 links
  • Networking and wireless base station infrastructure
  • Grid infrastructure and relay protection systems

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