ADMV1239

PRE-RELEASE

37.0 GHz to 43.5 GHz 2 Transmit/2 Receive Dual Polarization UDC + Beamformer

Analog Devices ADMV1239 Product Info

10 February 2026 6

Features

Integrated 16 (2x8) channel beamformer paired with a 2 transmit (TX) and 2 receive (RX) channel upconverter/downconverter (UDC)
RF range: 37.0 GHz to 43.5 GHz
x4 LO multiplier chain
Optional external filtering for spurious rejection
Significant power consumption reduction per beamformer channel vs. previous generations
16 configurable TX and RX channels
Dual polarization, 8 horizontal and 8 vertical channels paired to independent UDCs
Matched to 50 Ω, single-ended RF inputs/outputs and single-ended LO input
Fast TDD switching using TRX_x pins

On-chip temperature sensor for RX and TX automatic temperature compensation for Gain
Memory for TX and RX beam positions
NVM for phase and gain calibration
Upconversion mode

Sideband rejection and carrier feedthrough optimization
Envelope detector for LO feedthrough calibration
Single channel power detector

Downconversion mode

Integrated individual RX channel overload detection circuits

3-wire or 4-wire SPI that supports up to 133 MHz SPI clock speed

Part details & applications

The ADMV1239 is a 37.0 GHz to 43.5 GHz, mmW 5G dual channel upconverter, dual channel downconverter and beamformer integrated on a single chip. The RF integrated circuit (RFIC) combines two transmit/receive streams (2T2R) with 16 independent TX and RX beamformer channels in a 2 by 8 configuration supporting both single and dual polarization array designs.

The on-chip transmit receive switches connect the upconverter RF output and downconverter RF input for each polarization into eight independent channels via the 1:8 power splitters/combiners.

The ADMV1239 comes in a compact chip scale ball grid array package. The ADMV1239 operates over the −40°C to +95°C case temperature (T_C) range. This package allows heatsinking the ADMV1239 from the topside of the package for the most efficient thermal heatsinking and to allow flexible antenna placement on the opposite side of the printed circuit board (PCB).

APPLICATIONS

mmW 5G application

Broadband communication

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