ADIS16501

RECOMMENDED FOR NEW DESIGNS

Precision, MEMS IMU

Analog Devices ADIS16501 Product Info

10 February 2026 5

Features

Triaxial digital gyroscope, ±500°/sec
- 2.7°/hr in-run bias stability
- 0.15°/√hr angular random walk, x-axis and y-axis, 1 σ
- ±0.25° axis to axis misalignment error
Triaxial digital accelerometer, ±14 g dynamic range
- 12.7 μg in-run bias stability (x-axis and y-axis)
Triaxial delta angle and delta velocity outputs
Factory calibrated sensitivity, bias, and axial alignment
- Calibration temperature range: −40°C to +85°C

SPI compatible data communications
Programmable operation and control
- Automatic and manual bias correction controls
- Data ready indicator for synchronous data acquisition
- External sync modes: direct, scaled, and output
- On demand self test of inertial sensors
Single-supply operation (VDD): 3.0 V to 3.6 V
1500 g mechanical shock survivability
Operating temperature range: −40°C to +105°C

Part details & applications

The ADIS16501 is a precision, miniature microelectromechanical system (MEMS) inertial measurement unit (IMU) that includes a triaxial gyroscope and a triaxial accelerometer. Each inertial sensor in the ADIS16501 combines with signal conditioning that optimizes dynamic performance. The factory calibration characterizes each sensor for sensitivity, bias, alignment, linear acceleration (gyroscope bias), and point of percussion (accelerometer location).

The ADIS16501 provides a simplified, cost-effective method for integrating accurate, multiaxis inertial sensing into industrial systems, especially when compared with the complexity and investment associated with discrete designs. All necessary motion testing and calibration are part of the production process at the factory, greatly reducing system integration time. Tight orthogonal alignment simplifies inertial frame alignment in navigation systems. The serial peripheral interface (SPI) and register structure provide a simple interface for data collection and configuration control.

The ADIS16501 is available in a 100-ball ball grid array (BGA) module (MODULE) that is approximately 15 mm × 15 mm × 5.72 mm.

APPLICATIONS

Navigation, stabilization, and instrumentation
Unmanned and autonomous vehicles
Smart agriculture and construction machinery
Factory/industrial automation, robotics
Virtual/augmented reality
Internet of Moving Things

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