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ADGM1304
  • ADGM1304
  • ADGM1304
  • ADGM1304

ADGM1304

RECOMMENDED FOR NEW DESIGNS

0 Hz/dc to 14 GHz, Single-Pole, Four-Throw MEMS Switch with Integrated Driver

Analog Devices ADGM1304 Product Info

10 February 2026 5

Features

  • Fully operational down to 0 Hz/dc
    • On resistance: 2.9 Ω (maximum)
    • Off leakage: 0.5 nA (maximum)
  • −3 dB bandwidth
    • 11 GHz (typical) for RF1, RF4
    • 14 GHz (typical) for RF2, RF3
  • RF performance characteristics
    • Insertion loss: 0.26 dB (typical) at 2.5 GHz
    • Isolation: 24 dB (typical) at 2.5 GHz
    • IIP3: 69 dBm (typical)
    • RF power: 36 dBm (maximum)
  • Actuation lifetime: 1 billion cycles (minimum)
    • Hermetically sealed switch contacts
    • On switching time: 75 μs (maximum)
  • Integrated driver removes the need for an external driver
    • Supply voltage: 3.0 V to 3.6 V
    • CMOS-/LVTTL-compatible
    • Parallel and SPI interface
    • Independently controllable switches
  • Switch is in an open state with no power supply present
  • Requirement to avoid floating nodes on all RFx pins (see the Floating Node section in data sheet)
  • 24-lead, 5 mm × 4 mm × 0.95 mm, LFCSP
  • Operating temperature range: 0°C to 85°C

Part details & applications

The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small form factor, wide RF bandwidth, highly linear, low insertion loss switch that is operational from 0 Hz/dc to 14 GHz, making the ADGM1304 an ideal solution for a wide range of RF and precision equipment switching needs.

An integrated driver chip generates a high voltage to electrostatically actuate a switch that can be controlled by a parallel interface and a serial peripheral interface (SPI). All four switches are independently controllable.

The device is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm, lead frame chip-scale package (LFCSP).

To ensure optimum operation of the ADGM1304, the Critical Operational Requirements section must be followed exactly.

The on resistance (RON) performance of the ADGM1304 is affected by device to device variation, channel to channel variation, cycle actuations, settling time post turn on, bias voltage, and temperature changes.

APPLICATIONS

  • Relay replacements
  • Automatic test equipment: RF/high speed digital and mixed signals
  • Load and probe boards: RF/high speed digital and mixed signals
  • RF test instrumentation
  • Reconfigurable filters and attenuators
  • High performance RF switching

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