ADAR3002

RECOMMENDED FOR NEW DESIGNS

17.7 to 21.2 GHz, 2-Beam & 4-Element, Dual Polarized, Receive Ka Band Beamformer

Analog Devices ADAR3002 Product Info

10 February 2026 5

Features

17.7 GHz to 21.2 GHz frequency range
Noise figure (using electronic gain) = 2.0 dB
Low Power Consumption = 362mW (nominal bias setting)

8 Programmable Amplifier Bias settings

RMS gain error = 0.2 dB
RMS phase error = 2.3 degrees
Coherent gain = 25.1 dB at 19.5 GHz
- All 8 inputs driven
Single path gain = 7.1 dB at 19.5 GHz
IIP3 = −21.6 dBm at 19.5 GHz
IP1dB = -29.4 dBm at 19.5 GHz
Cross polarization isolation = 25 dB
0 degree to 360 degree phase adjustment range
5.625 degree step size/resolution
≥31 dB gain adjustment range
≤0.5 dB gain resolution

Memory for 256 prestored beam positions
- 64 Beamstates per Polarization per Beam
User programmable Sequencer for Beamstate selection
FIFO Memory for 64 beam positions
- 16 Beamstates per Polarization per Beam
Variable SPI length for flexible and efficient beam commands
- Update, reset, and mute from 1 up to 16 aperture beams
8-bit ADC for integrated temperature sensors and AMUX pin
3-wire or 4-wire SPI

Part details & applications

The ADAR3002 is a 17.7 GHz to 21.2 GHz receive, 2-beam and 4-dual polarized elements, beamforming chip for polarized phased arrays. Each of the 16 RF paths provides a ≥31 dB gain adjustment range and 360 degree phase adjustment, with resolution of less than ≤0.5 dB and 5.625 degrees, respectively, through variable amplitude and phase (VAP) blocks. Each VAP contains a digital stepped attenuator (DSA) and phase shifter unit (PSU).

Access to on-chip control registers and memory is through a simple 3-wire or 4-wire serial port interface (SPI). In addition, four address pins allow SPI control of up to 16 devices on the same serial lines. The random access memory (RAM) has storage for up to 256 beamstates, organized into 64 beamstates per polarization per beam. The sequencer selects and advances the beamstate being sourced from either the RAM or the FIFO.

ADAR3002 is available in a 176-ball 6.6 x 6.6 mm Wafer Level Chip Scale Package (WLCSP) and is specified from −40°C to +85°C.

APPLICATIONS

Mobile Ka Band Satcom Applications
Air Terminals
Ground Terminals
Maritime Terminals

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