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TPA6030A4
  • TPA6030A4

TPA6030A4

ACTIVE

3-W, stereo, 7.0- to 15.0- V, analog input Class-AB audio amplifier

Texas Instruments TPA6030A4 Product Info

1 April 2026 5

Parameters

Audio input type

Analog Input

Architecture

Class-AB

Speaker channels (max)

Stereo

Control interface

Hardware

Output power (W)

3

Power stage supply (max) (V)

15

Power stage supply (min) (V)

7

THD + N at 1 kHz (%)

0.1

Load (min) (Ω)

16

Analog supply voltage (min) (V)

7

Analog supply voltage (max) (V)

15

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Package

HTSSOP (PWP)-28-62.08 mm² 9.7 x 6.4

Features

  • 3 W Into 16 From 12-V Supply
  • Volume Control for Speakers (BTL) and Headphones (SE)
  • Differential Inputs
  • Depop Circuitry
  • 1 µA Shutdown Current
  • Surface Mount Package
  • APPLICATIONS
    • LCD Monitors and LCD TVs
    • Multimedia Speakers
    • Notebook Computers

PowerPAD is a trademark of Texas Instruments.

  • 3 W Into 16 From 12-V Supply
  • Volume Control for Speakers (BTL) and Headphones (SE)
  • Differential Inputs
  • Depop Circuitry
  • 1 µA Shutdown Current
  • Surface Mount Package
  • APPLICATIONS
    • LCD Monitors and LCD TVs
    • Multimedia Speakers
    • Notebook Computers

PowerPAD is a trademark of Texas Instruments.

Description

The TPA6030A4 is designed to drive 3 W into 16- speakers using a surface-mount package without the need for an external heatsink. These features make it ideal for 15" – 17" LCD monitors, small multimedia speakers, and notebook computers.

To simplify system design, the speaker volume level is adjusted by applying a dc voltage to the VOLUME terminal. The delta between speaker volume and headphone volume can be adjusted by applying a dc voltage to the SEDIFF terminal. To avoid an unexpected high volume level through the headphones, a third terminal, SEMAX, limits the headphone volume level when a dc voltage is applied. Integrated depop circuitry and the fully differential design minimize pops, clicks, and unwanted noise to provide a high level of audio performance.

The device is available in a 28-pin TSSOP PowerPAD™ package. The PowerPAD™ package is designed to transfer heat into the ground plane, eliminating the need for external heat sinks—minimizing solution cost and size.

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