0
ACTIVE
Number of channels |
1 |
Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) |
16 |
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) |
2.7 |
Rail-to-rail |
In to V-, Out |
GBW (typ) (MHz) |
0.16 |
Slew rate (typ) (V/µs) |
0.06 |
Vos (offset voltage at 25°C) (max) (mV) |
5 |
Iq per channel (typ) (mA) |
0.007 |
Vn at 1 kHz (typ) (nV√Hz) |
89 |
Rating |
Catalog |
Operating temperature range (°C) |
-40 to 125 |
Offset drift (typ) (µV/°C) |
1.1 |
Input bias current (max) (pA) |
60 |
CMRR (typ) (dB) |
86 |
Iout (typ) (A) |
0.0004 |
Architecture |
CMOS |
Input common mode headroom (to negative supply) (typ) (V) |
-0.2 |
Input common mode headroom (to positive supply) (typ) (V) |
-1.2 |
Output swing headroom (to negative supply) (typ) (V) |
0.05 |
Output swing headroom (to positive supply) (typ) (V) |
-0.05 |
SOIC (D)-8-29.4 mm² 4.9 x 6
The TLV27Lx single supply operational amplifiers provide rail-to-rail output capability. The TLV27Lx takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range, while adding the rail-to-rail output swing feature. The TLV27Lx also provides 160-kHz bandwidth from only 7 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) two rechargeable cells.
The rail-to-rail outputs make the TLV27Lx good upgrades for the TLC27Lx family—offering more bandwidth at a lower quiescent current. The TLV27Lx offset voltage is equal to that of the TLC27LxA variant. Their cost effectiveness makes them a good alternative to the TLC/V225x, where offset and noise are not of premium importance.
The TLV27L1/2 are available in the commercial temperature range to enable easy migration from the equivalent TLC27Lx. The TLV27L1 is not available with the power saving/performance boosting programmable pin 8.
The TLV27L1 is available in the small SOT-23 package—something the TLC27(L)1 was not—enabling performance boosting in a smaller package. The TLV27L2 is available in the 3mm × 5mm MSOP, providing PCB area savings over the 8-pin SOIC and 8-pin TSSOP.
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