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CSD95410RRB
  • CSD95410RRB
  • CSD95410RRB

CSD95410RRB

ACTIVE

90-A peak continuous synchronous buck NexFET™ smart power stage

Texas Instruments CSD95410RRB Product Info

1 April 2026 4

Parameters

Rating

Catalog

VDS (V)

20

Ploss current (A)

30

Features

Analog temperature output, Catastrophic over-current protection, Cycle-by-cycle over-current protection, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Integrated ringing reduction, Negative over-current protection, Powerstack vertical FET integration, Ultra-low inductance package

Operating temperature range (°C)

-40 to 125

Package

VQFN-CLIP (RRB)-41-30 mm² 6 x 5

Features

  • 90-A peak continuous current
  • Over 95% system efficiency at 30 A
  • High-frequency operation (up to 1.75 MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density industry common QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant: lead-free terminal plating
  • Halogen free
  • 90-A peak continuous current
  • Over 95% system efficiency at 30 A
  • High-frequency operation (up to 1.75 MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density industry common QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant: lead-free terminal plating
  • Halogen free

Description

The CSD95410NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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