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UPS5817
  • UPS5817

UPS5817

In Production

Ultra low forward voltage drop. High power surface mount package.

Microchip Technology UPS5817 Product Info

16 April 2026 0

Features

  • Ultra low forward voltage drop
  • Efficient heat path with integral locking bottom metal tab
  • High power surface mount package
  • Guard ring construction for transient protection
  • Compatible with Automatic Insertion Equipment
  • Full-metallic bottom eliminates flux entrapment
  • High surge capacity
  • Ideal for OR’ing diode
  • RoHS compliant
  • Description

    Ultra low forward voltage drop. High power surface mount package.

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