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UPS560
  • UPS560

UPS560

In Production

High power surface mount package.

Microchip Technology UPS560 Product Info

16 April 2026 0

Features

  • High power surface mount package
  • Guard ring construction for transient protection
  • Integral heat sink/locking tabs
  • Compatible with Automatic Insertion Equipment
  • Full-metallic bottom eliminates flux entrapment
  • High surge capacity
  • Ideal for OR’ing diode
  • Description

    High power surface mount package.

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