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UPS540
  • UPS540

UPS540

In Production

Very low thermal resistance package. Guard-ring-die construction for transient protection. Low forward voltage.

Microchip Technology UPS540 Product Info

16 April 2026 0

Features

  • Very low thermal resistance package
  • Guard-ring-die construction for transient protection
  • Efficient heat path with Integral locking bottom metal tab
  • Low forward voltage
  • Full metallic bottom eliminates flux entrapment
  • Compatible with automatic insertion
  • Description

    Very low thermal resistance package. Guard-ring-die construction for transient protection. Low forward voltage.

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