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MSC2X101SDA070J
  • MSC2X101SDA070J

MSC2X101SDA070J

In Production

Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability.This 700V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 100A ensures robust performance in high-power applications. The reverse leakage current is minimized to 30 µA, providing excellent efficiency and reliability. This dual SiC diode in a parallel configuration ensures enhanced current handling and improved thermal performance for demanding power systems. mSiC diodes in a SOT-227 package are designed for high-power applications requ...

Microchip Technology MSC2X101SDA070J Product Info

16 April 2026 0

Parameters

Reverse Voltage [max] Max

700

Forward Current (A) [max]

100

Forward Voltage [typ]

1.5

Reverse Leakage Current [typ] µA (microampere)

30

Total Capacitive Charge (Qc) V (volt)

266

Dual Diode

Yes

Configuration

Parallel

Junction Temperature (°C)

-55 - 175

Package Type

SOT-227

Features

  • No reverse recovery
  • Low forward voltage
  • Low leakage current
  • Avalanche-energy rated
  • RoHS compliant
  • Isolated voltage to 2500V, UL certified file E145592
  • Description

    Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability.

    This 700V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 100A ensures robust performance in high-power applications. The reverse leakage current is minimized to 30 µA, providing excellent efficiency and reliability. This dual SiC diode in a parallel configuration ensures enhanced current handling and improved thermal performance for demanding power systems. mSiC diodes in a SOT-227 package are designed for high-power applications requiring exceptional thermal performance and reliability.

    The SOT-227 package features a robust, isolated baseplate that ensures excellent heat dissipation. With the inherent advantages of SiC technology, the SOT-227 package supports higher current ratings and superior thermal cycling capabilities. Its modular design allows for easy parallel configurations and integration into high-power systems, providing a durable, efficient, and scalable solution for advanced energy applications.

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