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MSC030SDA070S
  • MSC030SDA070S

MSC030SDA070S

In Production

Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability. This 700V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 30A ensures robust performance in high-power applications. The reverse leakage current is minimized to 1 µA, providing excellent efficiency and reliability. mSiC diodes in a TO-268 package combine the superior efficiency and durability of SiC technology with a robust, compact design optimized for high-power applications. The TO-268 package features excellent thermal performance...

Microchip Technology MSC030SDA070S Product Info

16 April 2026 0

Parameters

Reverse Voltage [max] Max V (volt)

700

Forward Current (A) [max]

25

Forward Current Surge Peak Max A (ampere)

146

Forward Voltage [typ] V (volt)

1.5

Reverse Leakage Current [typ] µA (microampere)

1

Total Capacitive Charge (Qc) V (volt)

83

Dual Diode

No

Junction Temperature (°C)

-55 - 175

Package Type

TO-268 (D3PAK)

Features

  • No reverse recovery
  • Low forward voltage
  • Low leakage current
  • Avalanche-energy rated
  • RoHS compliant
  • Description

    Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability.

    This 700V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 30A ensures robust performance in high-power applications. The reverse leakage current is minimized to 1 µA, providing excellent efficiency and reliability. mSiC diodes in a TO-268 package combine the superior efficiency and durability of SiC technology with a robust, compact design optimized for high-power applications.

    The TO-268 package features excellent thermal performance and low thermal resistance, making it ideal for systems requiring efficient heat dissipation. The package’s flat, low-profile design supports high-current handling while ensuring reliable operation in challenging thermal environments, offering designers a perfect solution for space-constrained, high-reliability applications.

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