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MSC020SDA120D/S
  • MSC020SDA120D/S

MSC020SDA120D/S

In Production

Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability. This 1200V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 20A ensures robust performance in high-power applications. The reverse leakage current is minimized to 6 µA, providing excellent efficiency and reliability. Bare die mSiC diodes offer unmatched flexibility and performance for custom power module designs and compact, high-efficiency systems. Without a standard package, bare die SiC diodes enable direct integration onto substrat...

Microchip Technology MSC020SDA120D/S Product Info

16 April 2026 0

Parameters

Reverse Voltage [max] Max V (volt)

1200

Forward Current (A) [max]

22

Forward Current Surge Peak Max A (ampere)

115

Forward Voltage [typ] V (volt)

1.5

Reverse Leakage Current [typ] µA (microampere)

6

Total Capacitive Charge (Qc) V (volt)

91

Dual Diode

No

Junction Temperature (°C)

-55 - 175

Package Type

Die

Features

  • No reverse recovery
  • Low forward voltage
  • Low leakage current
  • Avalanche-energy rated
  • RoHS compliant
  • Description

    Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability.

    This 1200V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 20A ensures robust performance in high-power applications. The reverse leakage current is minimized to 6 µA, providing excellent efficiency and reliability. Bare die mSiC diodes offer unmatched flexibility and performance for custom power module designs and compact, high-efficiency systems.

    Without a standard package, bare die SiC diodes enable direct integration onto substrates, minimizing parasitic inductance and enhancing thermal management. Bare die SiC diodes provide ultra-fast switching, negligible reverse recovery losses, and exceptional high-temperature performance, allowing engineers to optimize layouts for maximum efficiency and reliability in cutting-edge, high-power applications.

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