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JANTX2N6211P-Transistor-PIND
  • JANTX2N6211P-Transistor-PIND

JANTX2N6211P-Transistor-PIND

In Production

This specification covers the performance requirements for PNP silicon, high-voltage, 2N6211, 2N6212, 2N6213 and 2N6213A transistors. Four levels of product assurance are provided for each encapsulated device (JAN, JANTX, JANTXV and JANS) as specified in MIL-PRF-19500/461. Two levels of product assurance are provided for each unencapsulated device (JANHC and JANKC).

Microchip Technology JANTX2N6211P-Transistor-PIND Product Info

16 April 2026 0

Features

  • The device package outlines are as follows: TO-66 for all encapsulated device types.
  • The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/461.

    • Description

    This specification covers the performance requirements for PNP silicon, high-voltage, 2N6211, 2N6212, 2N6213 and 2N6213A transistors. Four levels of product assurance are provided for each encapsulated device (JAN, JANTX, JANTXV and JANS) as specified in MIL-PRF-19500/461. Two levels of product assurance are provided for each unencapsulated device (JANHC and JANKC).


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