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JANKCBM2N5004-Transistor-Die
  • JANKCBM2N5004-Transistor-Die

JANKCBM2N5004-Transistor-Die

In Production

This specification covers the performance requirements for NPN, silicon, power, 2N5002 and 2N5004 transistors for use in high-speed power-switching applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/534. Two levels of product assurance (JANHC and JANKC) for each unencapsulated device type die.

Microchip Technology JANKCBM2N5004-Transistor-Die Product Info

16 April 2026 0

Features

  • The device package outline is a TO-210AA (formerly TO-59) for all encapsulated device types.

    • Description

    This specification covers the performance requirements for NPN, silicon, power, 2N5002 and 2N5004 transistors for use in high-speed power-switching applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/534. Two levels of product assurance (JANHC and JANKC) for each unencapsulated device type die.


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