• 16-Channel Push-Pull Output w/Return-To-Zero (RTZ) and High Impedance (Hi-Z) Functions
• Up to ±135V Output Voltage w/24 mA Minimum Source Sink Output Current (250pF Cload Max)
• Current Sensor Output
• SPI Interface with Quad-Latched (2-Bit/Channel) Architecture
• Power-On Reset Function
• Shutdown Function
• 59-Ball 8 x 8 mm TFBGA Package

HV53011 is a high-voltage driver solution for surface haptic applications. It consists of 16 push-pull drivers capable of +/-135V output swing with Return-To-Zero (RTZ) function. Each output driver is capable of sourcing

and sinking at least 24 mA. Each high-voltage output is capable of driving up to 250 pF capacitive load. A global current sensor function is also integrated into this device to monitor the charge and discharge currents.

The measured current is mapped to a low voltage analog output with a scale factor of 3.1 V/V via a current sensing resistor.

An SPI interface is used to communicate between the microcontroller/processor and the high voltage drivers. This interface accepts 3.3V logic I/O signals up to clock speeds of 32 MHz. Five digital LATCH control signals manage the data flow and the firing pattern. It establishes the output to one of four possible states: VPP, VNN, 0V or high impedance. 

A proper power on and off sequence is critical to ensure the operation of the high voltage driver. This driver requires four high voltage power rails, VPP, VPF, VNN, VNF, and three low voltage power rails, VCC, VSS

and VLL. A companion integrated driver IC, HV53001, has a built-in power on/off sequence control circuits to maintain the proper orders.

A shutdown function is available to disable the driver and set it to consume minimum power when the driver.

The HV53011 device is packaged in a 8 x 8 mm 59-ball TFBGA package. All high voltage I/O are assigned to have sufficient clearance for safety purpose.

Microchip has partnered with Tanvas to create this chipset that optimizes size and features for enabling surface haptic applications. Learn more >>