0
In Production
Vreg Output Voltage [V] |
5 |
Vreg Output Current [mA] |
85 |
Flash [kB] |
16 |
SRAM [kB] |
1 |
EEPROM [kB] |
0.5 |
Hardware Touch Peripheral |
None |
I2C |
1 |
SPI |
1 |
U(S)ART |
1 |
Operating Temperature Max [°C] |
125 |
Operative Voltage VS Max [V] |
27 |
Vreg Accuracy [%] |
2 |
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first chip, ATA6624 (LIN-system-basis-chip), has an integrated LIN transceiver, 5V voltage regulator and a window watchdog. The second chip contains the Microchip AVR ATmega168 automotive microcontroller with advanced RISC architecture and 16 Kbytes flash memory. All pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts.
WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK
