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A3P060
  • A3P060
  • A3P060
  • A3P060

A3P060

In Production

ProASIC3 offers high performance in ultra low density FPGAs, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. Key Features • Low TOC (total cost of ownership) • System performance of 350 MHz •  Proven Security    • Protection from Overbuilding and Cloning • Exceptional Reliability

Microchip Technology A3P060 Product Info

16 April 2026 0

Parameters

Analog

No

Data Security

No

FPGA I/O Max

No

Total RAM Kbit (kilobit)

18

Fabric ROM Kbit (kilobit)

1

Fabric uPROM Kbit (kilobit)

No

LogicElements(K)

0.7

Max. MSS I/O (3.3V) Max

No

Math Blocks 18x18

No

PCIe Lanes

No

Product Type

ProASIC3

Temp Max °C (degrees Celsius)

135

Temp Min °C (degrees Celsius)

-40

eNVM(KB) KB (kilobyte)

No

eSRAM(KB) KB (kilobyte)

No

Features

  • 700 logic elements
  • 18Kb RAM
  • 1Kb FlashROM
  • 1 PLL in CCC
  • Temperature - Commercial, Industrial, Automotive

Description

ProASIC3 offers high performance in ultra low density FPGAs, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features.
Key Features
• Low TOC (total cost of ownership)
• System performance of 350 MHz
•  Proven Security
   • Protection from Overbuilding and Cloning
• Exceptional Reliability

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