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1PMT5937
  • 1PMT5937

1PMT5937

In Production

This surface mountable 3.0 W Zener diode series in the JEDEC DO-216 package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V It is an ideal selection for applications requiring low profile and high-density mounting that are also RoHS Compliant When properly heat sunk, these Zener diodes provide power-handling capabilities only found in larger packages In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink Its innovative design makes this device ideal for use with automatic insertion equipment....

Microchip Technology 1PMT5937 Product Info

16 April 2026 0

Features

  • Very low-profile surface mount package (1.1 mm)
  • Integral Heat Sink Locking Tabs
  • Compatible with automatic insertion equipment
  • Full metallic bottom eliminates flux entrapment
  • RoHS Compliant
  • Zener voltage 3.3 to 200 Volts
  • Low reverse leakage
  • Tight tolerance available
  • Regulates voltage over a broad operating current and temperature range
  • Wide selection from 3.3 to 200 V
  • Flexible axial-lead mounting terminals
  • Non sensitive to ESD
  • Moisture classification is Level 1 per IPC/JEDEC J-STD-020B with no dry pack required
  • ESD Rating of >16kV per human body model.

    • Description

    This surface mountable 3.0 W Zener diode series in the JEDEC DO-216 package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for 3.3 to 200 V

  • It is an ideal selection for applications requiring low profile and high-density mounting that are also RoHS Compliant
  • When properly heat sunk, these Zener diodes provide power-handling capabilities only found in larger packages
  • In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink
  • Its innovative design makes this device ideal for use with automatic insertion equipment.

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