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1PMT5925B
  • 1PMT5925B

1PMT5925B

In Production

This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment....

Microchip Technology 1PMT5925B Product Info

16 April 2026 0

Features

  • Very low-profile surface mount package (1.1 mm)
  • Integral Heat Sink Locking Tabs
  • Compatible with automatic insertion equipment
  • Full metallic bottom eliminates flux entrapment
  • RoHS Compliant
  • Zener voltage 3.3 to 200 Volts
  • Low reverse leakage
  • Tight tolerance available
  • Regulates voltage over a broad operating current and temperature range
  • Wide selection from 3.3 to 200 V
  • Flexible axial-lead mounting terminals
  • Non sensitive to ESD
  • Moisture classification is Level 1 per IPC/JEDEC J-STD-020B with no dry pack required
  • ESD Rating of >16kV per human body model.

    • Description

    This Microchip Powermite® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment.

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