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SLC27TDL200AT
  • SLC27TDL200AT

SLC27TDL200AT

SLC27TDL200AT offers state-of-the-art CPU architecture featuring 32-bit Arm® v8-M based CPU and Integrity Guard double core, allowing rapid communication for fastest execution, ultra-low power consumption and best-in-class security. Ideal for transport applications, it offers innovative delivery forms. Additionally, the family concept optimizes development resources for a faster time to market, also reducing the certification efforts.

Infineon Technologies SLC27TDL200AT Product Info

16 April 2026 0

Parameters

Ambient Temperature range

-25 °C to 85 °C

Applications

Transport ticketing

Asymmetric Cryptography

ECC up to 521-bit, RSA up to 4096-bit, NRG

Certifications

CC EAL6+ high

CPU

TEGRION™ 32-bit Arm® v8-M

Delivery Forms

contactless module, dual-interface module, sawn wafer

Interfaces

ISO/IEC 7816, ISO/IEC 14443 A/B, ISO/IEC 18092 (NFC passive mode), NRG™ (ISO/IEC 14443-3 type A/B with CRYPTO1)

NVM

200 kByte

RAM

20 kByte

Symmetric Cryptography

AES up to 256-bit, DES, 3DES

Apps

Transport ticketing

Features

  • 28nm technology
  • 32-bit CPU based on Arm® v8-M
  • Integrity Guard 32
  • Fast communication speed
  • Ultra-low power consumption
  • Optimized for transport applications
  • Innovative delivery forms
  • Coil on Module (CoM)

Description

  • Fast time-to-market
  • Simplified programming
  • Streamlined certification
  • Extended product life times
  • Unmatched performance
  • Feature set to enable innovations
  • Market proven delivery forms
  • Best-in-class support structure

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