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P-M4.8
  • P-M4.8

P-M4.8

Contact-based module 8 contacts Epoxy Tape Wire Bond Mold

Infineon Technologies P-M4.8 Product Info

16 April 2026 0

Parameters

Applications

payment, government identification

Contact Surface

NiAu

Delivery Forms

Tape on Reel

Derivatives

Au surface, Pd surface

Dimensions

13 x 11.8mm

ISO – Reference

ISO 10373-1/-3, ISO 7810, ISO 7816-1

Pitch

14.25 mm

Product Description

8 contacts, mold, wire bond, epoxy tape, contact-based module

Product Name

P-M4.8

Thickness

max. 600μm

Features

  • 14.25mm
  • 13 x 11.8mm
  • max. 600?m
  • CIN
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, Pd surface
  • Tape on Reel

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