Product
0
IPG20N04S4-12
  • IPG20N04S4-12

IPG20N04S4-12

Infineon Technologies IPG20N04S4-12 Product Info

16 April 2026 0

Parameters

Budgetary Price €/1k

0.37

Country of Assembly (Last BE site, current, subject to change)

China, Malaysia

Country of Diffusion (Last FE site, current, subject to change)

Malaysia

ID (@25°C) max

20 A

IDpuls max

80 A

Launch year

2011

Operating Temperature range

-55 °C to 175 °C

Package

dual SS08 (PG-TDSON-8)

Planned to be available until at least

2030

Polarity

N+N

Ptot max

41 W

QG (typ @10V)

14 nC

QG (typ @10V) max

18 nC

Qualification

Automotive

RDS (on) (@10V) max

12.2 mΩ

RthJC max

3.7 K/W

Technology

OptiMOS™T2

VDS max

40 V

VGS(th) range

2 V to 4 V

VGS(th)

3 V

Apps

Door control module, Automotive instrument cluster, Industrial automation

Features

  • Dual N-ch-Normal Level-Enhancement mode
  • Automotive AEC Q101 qualified
  • MSL1 up to 260°C peak reflow
  • 175°C operating temperature
  • Green Product (RoHS compliant)
  • 100% Avalanche tested
  • PPAP Capable Device
  • Dual Super S08 substitutes DPAKs

Description

  • Significant PCB area savings
  • System level cost reduction
  • Bond wire is 200um for up to 20A current
  • Larger source lead for wire bonding
  • Package: PG-TDSON-8-4
  • Equal performance to DPAK, same die size
  • Exposed pad for thermal transfer
  • 2 N-Channel MOSFETs; Isolated Leadframes

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8