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IM73D122
  • IM73D122

IM73D122

Active and preferred

Infineon's ultra-low noise digital XENSIV™ MEMS microphone, IM73D122, features high SNR and sensitivity for high-quality audio capturing in laptops, tablets, and conferencing devices. Based on Infineon's Sealed Dual Membrane (SDM) MEMS technology, it delivers high IP57 ingress protection. Perfect for voice user interface applications.

Infineon Technologies IM73D122 Product Info

16 April 2026 0

Parameters

AEC-Q103-003 qualified

on demand

AOP

122 dBSPL

Current Consumption

980 µA

Green

RoHS compliant, Halogen free

Interfaces

Digital PDM

LFRO

20 Hz

Package dimensions

4.00 x 3.00 x 1.20 mm³

Sensitivity

-26 dBFS

SNR

73 dB(A)

Supply Voltage

1.62 - 3.60 V

Features

  • Ultra-low self-noise/ultra-high SNR 73dB(A)
  • Very high sensitivity (-26 dBFS)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • High dynamic range and acoustic overload point (AOP) of 122 dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 20Hz
  • Very low group delay (7µs @ 1kHz)

Description

  • Powerful far-field and low volume audio pick-up
  • Robust ingress protection (IP57) at a microphone level
  • Enablement of advanced audio features (audio zoom, beamforming)

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