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IM70A135
  • IM70A135

IM70A135

Active and preferred

Infineon's XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm³. This microphone is based on Infineon's new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.

Infineon Technologies IM70A135 Product Info

16 April 2026 0

Parameters

AEC-Q103-003 qualified

on demand

AOP

135 dBSPL

Current Consumption

170 µA

Green

RoHS compliant, Halogen free

Interfaces

Analog differential

LFRO

37 Hz

Package dimensions

3.50 x 2.65 x 0.98 mm³

Sensitivity

-38 dBV

SNR

70 dB(A)

Supply Voltage

1.52 - 3.00 V

Apps

AI and data center, Automotive body control module (BCM), Health and lifestyle

Features

  • Very High 70dB(A) Signal-to-noise ratio
  • Ultra-low power modes for battery critical applications (170/70µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra-high acoustic overload point (AOP) of 135dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz

Description

  • Powerful far-field and low volume audio pick-up
  • Crystal clear audio signals even in compact package size
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

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