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FS900R08A2P2_B32
  • FS900R08A2P2_B32

FS900R08A2P2_B32

HybridPACK™ 2 750 V, 900 A 3-phase six-pack of Micro-Pattern EDT2 TRENCHSTOP™ with matching emitter controlled diode is an automotive qualified power module with direct cooled PinFin Base Plate designed for Hybrid- and Electric Vehicle applications from a power range up to 150 kW continuous power. Pin connection is enabled via Au coated pins.

Infineon Technologies FS900R08A2P2_B32 Product Info

16 April 2026 0

Parameters

Applications

eMobility, Hybrid Electric Vehicles, Drives, CAV, Aircon

Configuration

Sixpack

Cooling Concept

PinFin baseplate

Dimensions (width)

84.5 mm

Dimensions (length)

197 mm

Features

PinFin

Housing

HybridPACK™ 2

IC(nom) / IF(nom)

900 A

IC max

900 A

Qualification

Automotive

Technology

IGBT EDT2

VCE(sat) (Tvj=25°C typ)

1.1 V

VCES (Tvj=25°C typ)

750 V

VF (Tvj=25°C typ)

1.4 V

Voltage Class max

750 V

Features

  • VCEsat with positive temperature coefficient
  • Low VCEsat
  • Low switching losses
  • Low Qg and Cres
  • Low inductive design
  • T vj op = 150°C
  • Short-time extended operation temperature T vj op = 175°C
  • 2.5 kV AC 1min insulation
  • Direct cooled base plate
  • High power density
  • Integrated NTC temperature sensor
  • Copper base plate
  • Isolated base plate
  • RoHS compliant

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