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FS820R08A6P2
  • FS820R08A6P2

FS820R08A6P2

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications . The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics.

Infineon Technologies FS820R08A6P2 Product Info

16 April 2026 14

Parameters

Applications

CAV, eMobility, Hybrid Electric Vehicles, Drives

Configuration

Sixpack

Cooling Concept

PinFin baseplate

Dimensions (length)

152 mm

Dimensions (width)

92 mm

Features

PinFin Baseplate, Short Tabs

Housing

HybridPACK™ Drive

IC(nom) / IF(nom)

820 A

IC max

1640 A

Qualification

Automotive

Technology

IGBT EDT2

VCE(sat) (Tvj=25°C typ)

1.1 V

VCES (Tvj=25°C typ)

750 V

VF (Tvj=25°C typ)

1.45 V

Voltage Class max

750 V

Apps

EV traction inverter

Features

  • Blocking voltage 750V
  • Low VCEsat
  • Low Switching Losses
  • Low Qg and Cres
  • Low Inductive Design
  • Tvj op = 150°C
  • Short-time ext Op Tvj op = 175°C

Description

  • Compact Design
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Mechanical guiding elements

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