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FS75R07W2E3_B11A
  • FS75R07W2E3_B11A

FS75R07W2E3_B11A

EasyPACK™ 2B Modules with TRENCHSTOP™ IGBT3, Emitter Controlled 3 diode and PressFIT / NTC.

Infineon Technologies FS75R07W2E3_B11A Product Info

16 April 2026 0

Parameters

Applications

Hybrid Electric Vehicles, eMobility, Drives, CAV, Aircon

Configuration

Sixpack

Cooling Concept

Flat baseplate

Dimensions (width)

42.5 mm

Dimensions (length)

51 mm

Features

PressFIT

Housing

EasyPACK™ 2B

IC(nom) / IF(nom)

75 A

IC max

75 A

Qualification

Automotive

Technology

IGBT3 - E3

VCE(sat) (Tvj=25°C typ)

1.45 V

VCES (Tvj=25°C typ)

650 V

VF (Tvj=25°C typ)

1.55 V

Voltage Class max

650 V

Features

  • blocking voltage capability to 650V
  • Low Switching Losses
  • Low VCEsat
  • Trench IGBT 3
  • Al Substrate Low Thermal Restistance
  • High Power Density
  • Compact Design
  • PressFIT Contact tech
  • RoHS compliant
  • Rugged mounting clamps

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