Product
0
FS3L50R07W2H3F_B11
  • FS3L50R07W2H3F_B11

FS3L50R07W2H3F_B11

Active and preferred

EasyPACK™ 2B 650 V, 50 A 3-level IGBT module with CoolSiC™ Schottky diode 650V , PressFIT contact technology and High Speed IGBT H3.

Infineon Technologies FS3L50R07W2H3F_B11 Product Info

16 April 2026 0

Parameters

Configuration

3-level

Dimensions (length)

56.7 mm

Dimensions (width)

48 mm

Features

PressFIT, SiC Schottky diode, Full-bridge

Housing

EasyPACK™ 2B

IC(nom) / IF(nom)

50 A

IC max

50 A

Qualification

Industrial

Technology

IGBT3 - H3

VCE(sat) (Tvj=25°C typ)

1.45 V

VCES / VRRM

650 V

VF (Tvj=25°C typ)

1.6 V

Voltage Class max

650 V

Apps

Photovoltaic, Motor control, Uninterruptible power supplies (UPS)

Features

  • Low switching losses
  • Al2O3 substrate
  • Rugged mounting due to
  • Integrated mounting clamps

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8