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FS3L30R07W2H3F_B11
  • FS3L30R07W2H3F_B11

FS3L30R07W2H3F_B11

EasyPACK™ 2B 650 V, 60 A 3-level NPC1 full-bridge IGBT module with CoolSiC™ Schottky diode 650V , PressFIT Contact technology and High Speed IGBT H3.

Infineon Technologies FS3L30R07W2H3F_B11 Product Info

16 April 2026 0

Parameters

Configuration

3-level

Dimensions (width)

48 mm

Dimensions (length)

56.7 mm

Features

PressFIT, SiC Schottky diode, Full-bridge

Housing

EasyPACK™ 2B

IC(nom) / IF(nom)

30 A

IC max

30 A

Qualification

Industrial

Technology

IGBT3 - H3

VCE(sat) (Tvj=25°C typ)

1.5 V

VCES / VRRM

650 V

VF (Tvj=25°C typ)

1.6 V

Voltage Class max

650 V

Apps

Photovoltaic, Motor control, Uninterruptible power supplies (UPS)

Features

  • Low switching losses
  • Al2O3 substrate
  • Rugged mounting due to
  • Integrated mounting clamps

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