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FS3L25R12W2H3_B11
  • FS3L25R12W2H3_B11

FS3L25R12W2H3_B11

Active and preferred

EasyPACK™ 2B 1200 V, 25 A 3-level full-bridge IGBT module with active "Neutral Point Clamp 2" topology, NTC, High Speed IGBT H3 and PressFIT Contact Technology.

Infineon Technologies FS3L25R12W2H3_B11 Product Info

16 April 2026 0

Parameters

Configuration

3-level

Dimensions (length)

56.7 mm

Dimensions (width)

48 mm

Features

PressFIT

Housing

EasyPACK™ 2B

IC(nom) / IF(nom)

25 A

IC max

25 A

Qualification

Industrial

Technology

IGBT3 - H3

VCE(sat) (Tvj=25°C typ)

2.05 V

VF (Tvj=25°C typ)

1.75 V

Voltage Class max

1200 V

Apps

Photovoltaic

Features

  • High Speed IGBT H3
  • Low switching losses
  • Fast Si clamping diodes 25 A, 650 V
  • PressFIT contact technology
  • Integrated mounting clamps
  • Rugged mounting
  • Al2O3 substrate with:
  • Low thermal resistance

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