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FS02MR12A8MA2B
  • FS02MR12A8MA2B

FS02MR12A8MA2B

Active and preferred

Infineon Technologies FS02MR12A8MA2B Product Info

16 April 2026 0

Parameters

Configuration

Sixpack

Features

PinFin Baseplate, Short Tabs

Housing

HybridPACK™ Drive G2

Launch year

2024

Package

AG-HDSICXT-1

Planned to be available until at least

2040

Qualification

Automotive

RthJC max

0.121 K/W

Technology

CoolSiC™ G2

VCES (Tvj=25°C typ)

1200 V

Voltage Class max

1200 V

Features

  • New semicond. material - silicon carbide
  • Low RDS(on)
  • Low switching losses
  • Low Qg and Crss
  • 4.2 kV DC 1 second insulation
  • High creepage and clearance distances
  • Compact design
  • High power density
  • Direct-cooled PinFin base plate
  • High-performance Si3N4 ceramic
  • PCB and cooler assembly guidelines
  • Integrated temperature sensing diode

Description

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • Lower system BOM
  • Lower AC contact resistance
  • Lower tab temperature
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

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