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FF4MR12W2M1HP_B11_A
  • FF4MR12W2M1HP_B11_A

FF4MR12W2M1HP_B11_A

Active and preferred

AQG324 qualified EasyDUAL™ 2B CoolSiC™ MOSFET half-bridge module 1200V, 4 mΩ with NTC temperature sensor, pre-applied Thermal Interface Material and PressFIT Contact Technology for EV power conversion and eAviation ecosystem

Infineon Technologies FF4MR12W2M1HP_B11_A Product Info

16 April 2026 0

Parameters

Applications

SST, SPU, UPS, OBC, EV Charger

Configuration

Half-bridge

Dimensions (width)

48 mm

Dimensions (length)

62.8 mm

Features

PressFIT, TIM

Housing

Easy 2B

Qualification

Industrial

RDS (on) (@ Tj = 25°C)

4 mΩ

Apps

Server power supply units (PSU), EV power conversion & OBC, EV charging, Uninterruptible power supplies (UPS)

Features

  1. Best in class package with 12mm height
  2. Leading edge WBG material
  3. CoolSiC™ for high switching frequencies
  4. Lowest RDSon and FIT rate
  5. Pre-applied Thermal Interface Material
  6. Available with PressFIT Pin and Solder Pin

Description

  1. Compact and lightweight design
  2. Reduced system size and weight
  3. Reliable package concept
  4. Increased power density and high efficiency
  5. Reduced development time and costs
  6. AQG324 qualified to support automotive standards

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