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FF3MR20KM1HP
  • FF3MR20KM1HP

FF3MR20KM1HP

Active and preferred

62 mm CoolSiC™ MOSFET half-bridge module 2000 V, 2.6 mΩ G1 in the well known 62mm housing combined with M1H chip technology and pre-applied Thermal Interface Material (TIM).

Infineon Technologies FF3MR20KM1HP Product Info

16 April 2026 0

Parameters

Applications

EV Charger, Solar, UPS, Traction, ESS

Configuration

Half-bridge

Dimensions (width)

61.4 mm

Dimensions (length)

106.4 mm

Features

TIM

Housing

62 mm

Qualification

Industrial

RDS (on) (@ Tj = 25°C)

2.6 mΩ

Apps

Battery energy storage (BESS), EV charging, Traction, Photovoltaic, Uninterruptible power supplies (UPS)

Features

  • High current density
  • Low switching losses
  • Superior gate oxide reliability
  • Highest robustness against humidity
  • Robust integrated body diode
  • High cosmic ray robustness
  • High speed switching module
  • Symmetrical module design
  • Standard construction technique

Description

  • Minimizes cooling efforts
  • Reduction in volume and size
  • Reduced system costs
  • Improved chip performance

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