Product
0
FF17MR12W1M1H_B70
  • FF17MR12W1M1H_B70

FF17MR12W1M1H_B70

Active and preferred

EasyDUAL™ 1B 1200 V, 17 mΩ half-bridge module with CoolSiC™ MOSFET enhanced generation 1, integrated NTC, PressFIT Contact Technology and aluminium nitride ceramic.

Infineon Technologies FF17MR12W1M1H_B70 Product Info

16 April 2026 0

Parameters

Applications

ESS, EV Charger, Solar, UPS

Configuration

Half-bridge

Dimensions (length)

62.8 mm

Dimensions (width)

33.8 mm

Features

PressFIT, AlN

Housing

Easy 1B

Qualification

Industrial

RDS (on) (@ Tj = 25°C)

17 mΩ

Apps

EV charging, Uninterruptible power supplies (UPS)

Features

  • Best-in-class package: 12 mm height
  • Easy module packages
  • Very low module stray inductance
  • Wide RBSOA
  • 1200 V CoolSiC™ MOSFET
  • Gate drive vol.: +15…+18 V & 0…-5 V
  • Max. gate-source v.: +23 V & -10 V
  • Tvjop under overload condi. < 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor
  • Aluminium nitride ceramic

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8