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FF1400R23T2E7_B5
  • FF1400R23T2E7_B5

FF1400R23T2E7_B5

Active and preferred

XHP™ 2 2300 V, 1400 A half-bridge IGBT module in low inductive XHP™ 2 housing including TRENCHSTOP™ IGBT7 for high power density and providing 6 kV isolation voltage to address 3-level topologies. Also available with pre-applied Thermal Interface Material (TIM).

Infineon Technologies FF1400R23T2E7_B5 Product Info

16 April 2026 0

Parameters

Configuration

half-bridge

Dimensions (length)

140 mm

Dimensions (width)

100 mm

Features

6 kV iso

Housing

XHP™ 2

IC(nom) / IF(nom)

1400 A

IC max

1400 A

Qualification

Industrial

Technology

IGBT7 - E7

VCE(sat) (Tvj=25°C typ)

1.85 V

VCES / VRRM

2300 V

VF (Tvj=25°C typ)

3.05 V

Voltage Class max

2300 V

Apps

Traction, Photovoltaic, Wind power, Motor control

Features

  • Low inductive XHP™ 2 housing
  • Extended operation temperature (Tvj max=175°C)
  • Package with CTI > 600
  • 6 kV isolation voltage
  • AlSiC baseplate

Description

  • Easier paralleling of modules
  • Enables higher system overload conditions
  • Energy efficiency
  • High power density

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