Product
0
FF08MR12W1MA1_B11A
  • FF08MR12W1MA1_B11A

FF08MR12W1MA1_B11A

EasyPACK™ 1B , 8 mΩ halfbridge module implementing the new CoolSiC ™ Automotive MOSFET 1200V, NTC temperature sensor and PressFIT contact technology . With the full automotive qualification, the field of applications for CoolSIC™ is now extended to high voltage automotive applications with high efficiency and switching frequency requirements, such as HV/HV DC-DC step-up converters, multiphase inverters and fast-switching auxiliary drives like fuel-cell compressors.

Infineon Technologies FF08MR12W1MA1_B11A Product Info

16 April 2026 0

Parameters

Configuration

Half-bridge

Dimensions (length)

62.8 mm

Dimensions (width)

33.8 mm

Features

PressFIT

Housing

Easy 1B

ID

150 A

Launch year

2020

Planned to be available until at least

2033

Qualification

Automotive

RDS (on) (@ Tj = 25°C)

8 mΩ

Apps

Automotive, Automotive secondary power distribution unit, DC-DC converter high-voltage, Power conversion

Features

  • High gate threshold Vth=4.4V
  • Driving voltage VGS=-5V/ +15V
  • Intrinsic diode with reverse recovery
  • Low stray inductance 5nH
  • Blocking voltage 1200V
  • Low Switching Losses
  • Tvjop=150°C

Description

  • Easy system assembly
  • Superior reliability
  • Flexibility (half bridge concept)
  • Integrated NTC temperature sensor
  • Fully qualified automotive applications
  • RoHS compliant

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8