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F4-75R07W1H3_B11A
  • F4-75R07W1H3_B11A

F4-75R07W1H3_B11A

EasyPACK™ 1B Module with fast TRENCHSTOP™ IGBT3, Rapid 1 diode and PressFIT / NTC

Infineon Technologies F4-75R07W1H3_B11A Product Info

16 April 2026 0

Parameters

Applications

Welding, Induction Heating, Hybrid Electric Vehicles, eMobility, CAV, Battery Management

Configuration

Fourpack

Cooling Concept

Flat baseplate

Dimensions (length)

48 mm

Dimensions (width)

33.8 mm

Features

PressFIT

Housing

EasyPACK™ 1B

IC(nom) / IF(nom)

75 A

IC max

75 A

Launch year

2014

Planned to be available until at least

2025

Qualification

Automotive, Industrial

Technology

IGBT HighSpeed 3

VCE(sat) (Tvj=25°C typ)

1.5 V

VCES (Tvj=25°C typ)

650 V

VF (Tvj=25°C typ)

1.65 V

Voltage Class max

650 V

Features

  • Automotive High Speed IGBT H3 and Rapid 1 Diode
  • Low Switching Losses
  • Low inductive design
  • 2.5 kV AC 1min Insulation
  • High Creepage and Clearance Distances
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Rugged mounting due to integrated mounting clamps

Description

  • Excellent Cost/Performance ratio for fast switching automotive DCDC converter and on-board charger solutions.

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