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F3L225R07W2H3P_B63
  • F3L225R07W2H3P_B63

F3L225R07W2H3P_B63

Active and preferred

EasyPACK™ 2B 650 V 225 A 3-level phase leg IGBT module with High Speed IGBT H3, NTC, active "Neutral Point Clamp 2", PressFIT Contact Technology and pre-applied Thermal Interface Material .

Infineon Technologies F3L225R07W2H3P_B63 Product Info

16 April 2026 0

Parameters

Configuration

3-level

Dimensions (width)

48 mm

Dimensions (length)

56.7 mm

Features

Phase leg, PressFIT, TIM

Housing

EasyPACK™ 2B

IC(nom) / IF(nom)

225 A

IC max

225 A

Qualification

Industrial

Technology

IGBT3 - H3

VCE(sat) (Tvj=25°C typ)

1.4 V

VCES / VRRM

650 V

VF (Tvj=25°C typ)

1.55 V

Voltage Class max

650 V

Apps

Photovoltaic, Motor control, Uninterruptible power supplies (UPS)

Features

  • Low inductive design
  • Low switching losses
  • Low VCEsat
  • Al2O3 substrate
  • Compact design
  • PressFIT contact technology
  • Rugged mounting due to
  • Integrated mounting clamps

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