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CYW55573
  • CYW55573

CYW55573

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The AIROC™ CYW55573 is Infineon's highest-performing tri-band Wi-Fi 6/6E (2.4G, 5G, 6G) 2x2 MIMO solution. It features improved range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers a high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.

Infineon Technologies CYW55573 Product Info

16 April 2026 0

Parameters

Antenna Configuration

2x2

Bluetooth Interface

UART/PCM/I2S

Bluetooth Specification

Bluetooth 6.0

Core

Cortex M33

CPU

N/A

Dimensions

12 x 12 mm, 5.32 x 5.67 mm, 5.3 x 5.7 mm

Family

AIROC™ Wi-Fi + Bluetooth® Combos

Launch Date

2023

Longevity - 15 years

Yes

Longevity - Extended

No

Memory

N/A

Operating system support

Linux, Android

Operating Temperature range

-40 °C to 85 °C

Operating Voltage range

3 V to 4.8 V

Package

FCFBGA-289, WLCSP-486, WLBGA-225

Partner Module

Y

Pitch

0.65 mm, 0.2 mm, 0.35 mm

Planned to be available until at least

01-01-2038

Product Description

Wi-Fi 6 Combo

ROM

2048 KB

SRAM

512 kByte

Wi-Fi Band

2.4GHz, 5GHz, 6GHz

Wi-Fi Bandwidth

80 MHz

WI-FI Interface

SDIO/PCIe

Wi-Fi Specification

Wi-Fi 6E (802.11ax)

Apps

Microinverter solutions

Features

  • Wi-Fi 6/6E, Tri-band, 2x2 MIMO
  • 20/40/80 MHz, up to 1.2 Gbps PHY rate
  • OFDMA, MU-MIMO, TWT,DCM
  • Enhanced range, pwr & network efficiency
  • Multi-layer security protection
  • Smart coexistence
  • Temperature: -40°C to 85°C
  • Bluetooth® 5.3, Dual-mode operation
  • LE audio w/Auracast, LE- 2M, LR, Adv Ext
  • Bluetooth transmit at 20dbm/13dbm/0 dbm

Description

  • Performance beyond Wi-Fi 6/6e
  • Maximizes network efficiency
  • Extended edge AI+IoT device capabilities
  • High quality Bluetooth® LE audio
  • Multi-layer security protection
  • Accelerates time to market
  • Reduces development costs

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