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CYW55571
  • CYW55571

CYW55571

Active and preferred

The AIROC™ CYW55571 is Infineon's highest-performing tri-band Wi-Fi 6/6E (2.4G, 5G, 6G) 1x1 80 MHz SISO solution. It features improved range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers high performance in congested network environments and significantly reduces latency by operating in the 6G spectrum.

Infineon Technologies CYW55571 Product Info

16 April 2026 0

Parameters

Antenna Configuration

1x1

Bluetooth Interface

UART/PCM/I2S

Bluetooth Specification

Bluetooth 6.0

Core

Cortex M33

CPU

N/A

Dimensions

5.32 x 5.67 mm, 12 x 12 mm, 5.3 x 5.7 mm

Family

AIROC™ Wi-Fi + Bluetooth® Combos

GPIOs

15

Launch Date

2023

Longevity - 15 years

Yes

Longevity - Extended

No

Memory

N/A

Operating system support

Linux, Android

Operating Temperature range

-40 °C to 85 °C

Operating Voltage range

3 V to 4.8 V

Package

FCFBGA-289, WLCSP-486, WLBGA-225

Partner Module

Y

Pitch

0.35 mm, 0.2 mm, 0.65 mm

Planned to be available until at least

01-01-2038

Product Description

Wi-Fi 6 Combo

ROM

2048 KB

SRAM

512 kByte

Wi-Fi Band

2.4GHz, 5GHz, 6GHz

Wi-Fi Bandwidth

80 MHz

WI-FI Interface

SDIO/PCIe

Wi-Fi Specification

Wi-Fi 6E (802.11ax)

Apps

Automotive telematics control unit (TCU), Semiconductor solutions for home entertainment applications, Smart speaker designs, Home appliances, Industrial automation

Features

  • Wi-Fi 6/6E, Tri-band, 2x2 MIMO
  • 20/40/80 MHz, up to 600 Mbps PHY rate
  • OFDMA, MU-MIMO, TWT,DCM
  • Multi-layer security protection
  • Smart coexistence
  • Bluetooth® 5.3, Dual-mode operation
  • Bluetooth transmit at 20dbm/13dbm/0 dbm
  • WLAN: PCIe, SDIO, BT: UART, I2S, PCM
  • Temperature: -40°C to 85°C

Description

  • Performance beyond Wi-Fi 6/6e
  • Maximizes network efficiency
  • Extended edge AI+IoT device capabilities
  • High quality Bluetooth® LE audio
  • Multi-layer security protection
  • Accelerates time to market
  • Reduces development costs

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